Directed Self‐Assembly with Sub‐100 Degrees Celsius Processing Temperature, Sub‐10 Nanometer Resolution, and Sub‐1 Minute Assembly Time

and thus alternative technologies such as extreme ultraviolet (EUV) lithography, nanoimprint lithography, interference lithography, and directed self-assembly (DSA) are emerging rapidly. [ 2 , 3 , 8–16 ] DSA of block copolymers (BCPs) has recently attracted much attention as a promising candidate for nextgeneration lithography due to its capacity to provide excellent resolution and scalability. [ 3 , 17–25 ] The self-assembly of a BCP, where two mutually incompatible polymer chains are connected via covalent bonding, can create sub-20 nm periodic patterns with different geometries such as dots, lines, holes, and rings, [ 17 , 18 , 26–28 ] while even more complex features such as bends, T-junctions, and jogs have already been demonstrated. [ 29 ]