Bisphenol A simulated ether-bond-containing model compound of cured epoxy resin and preparation method thereof

The invention relates to a model compound of cured epoxy resin and a preparation method thereof, particularly a bisphenol A simulated ether-bond-containing model compound of cured epoxy resin and a preparation method thereof. The invention solves the problem that the existing method for researching decomposition rules of cured epoxy resin is complex. The structural formula of the model compound provided by the invention is disclosed in the specification. The method comprises the following steps: adding bisphenol A, phenyl glycidyl ether and sodium hydroxide into a container, stirring at 95-105 DEG C for 3-4 hours, and washing to obtain the model compound. According to the structural formula, the model compound has a bisphenol A structure and an ether bond structure, and the decomposition characteristics and decomposition products of the model compound can be researched to provide references for disclosing the decomposition rules of epoxy resin.