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The Design and Reliability of Flip Chip Attach Joint on Surface Laminar Circuit
The Design and Reliability of Flip Chip Attach Joint on Surface Laminar Circuit
1993
Yutaka Tsukada
Yohko Mashimoto
Noriyuki Watanuki
Keywords:
Electronic engineering
Thermal copper pillar bump
Flip chip
Materials science
Laminar flow
Correction
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