Composition, cured object, and electronic device

Disclosed is a composition comprising (A) an organometallic compound, (B) inorganic particles or organic-polymer particles, and (C) a binder ingredient. The organometallic compound (A) preferably is a compound represented by general formula (1): (R 1 ) n M (1) wherein R 1 is a hydrogen atom or an organic group and the R 1 s may be the same or different, n is 2 or 3 and is equal to the valence of M, and M is a di- or trivalent metal atom.