Led package and method for manufacturing the same

PURPOSE: A light emitting diode(LED) package and a method for manufacturing the same are provided to improve thermal conductivity and thermal radiation capacity by forming asymmetrically two metals which forms the LED package. CONSTITUTION: A reflective surface(130) and a lead frame(110) are respectively integrated into a cathode(111) and an anode(112). One end of the cathode and one end of the anode are expanded from the lead frame. The other ends of the cathode and the anode are opposite to each other. A reflective surface is formed by deforming at least part of the cathode and the anode. The reflective surface has an angle more than 90 degrees with respect to the cathode or the anode.