Research and numerical simulation of thermal conductivity of SiCp/6061Al composite fabricated by pressureless infiltration

In this paper, finite element models of SiCp/6061Al composites with different volume fractions of SiC particles with W50/W14 and W85/W28 ratios of 2:1 were constructed using digimat software. Then the model was introduced into ABAQUS finite element software for thermal conduction simulation. The thermal conductivity of SiCp/6061Al composites was calculated and the effects of different volume fractions and particle sizes on the thermal conductivity of the composites was obtained. Then The thermal conductivity results of the finite element simulation are compared with theoretical model values and the experimental values of SiCp/6061Al composites prepared by pressureless infiltration method. it is found that the thermal conductivity changes of the three results are consistent, and the thermal conductivity of SiCp/6061Al composites increases with the volume fraction and size of SiC particles, the experimental values are small due to the experimental deviation and the existence of defects.