Module of monolithic lcp-polymer microelectronic wiring

PROBLEM TO BE SOLVED: To provide a multilayered microelectronic printed circuit board, which can connect the circuit layer comprising the PCB including electric wirings together without heating the liquid crystal component of the circuit layer to the melting point of the component or higher. SOLUTION: This module is constituted by including vias in a plurality of circuit layers and including the laminate of a plurality of the circuit layers, containing the assembly of the conducting vias and conducting wiring patterns on the surfaces of the circuit layers. Each circuit layer includes a first liquid polymer. Between the circuit layers, the bonding layer comprising the second liquid crystal layer having the melting point, which is lower than the melting point of the first liquid crystal polymer by at least about 10 deg.C, is inserted. Thus, the multilayered microelectronic printed circuit board is provided.