Heat-dissipating structure and semiconductor module using same

The purpose of the present invention is to provide a heat-dissipating structure and a semiconductor module with superior thermal reliability. In order to solve the above-described problem, the present invention provides: a heat-dissipating structure formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. The present invention is characterized in that: at least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles; the lead-free low-melting-point glass composition accounts for 78 mol% or more in terms of the total of the oxides V 2 O 5 , TeO 2 , and Ag 2 O serving as main ingredients; the content of each of TeO 2 and Ag 2 O is 1 to 2 times the content of V 2 O 5 ; at least one of BaO, WO 3 , and P 2 O 5 is included as accessory ingredients in a total of 20 mol% or less; and at least one of Y 2 O 3 , La 2 O 3 , and Al 2 O 3 is included as additional ingredients in a total of 2.0 mol% or less.