Photoresist stripper composition, and a photoresist peeling method employing the same

The present invention relates to a stripper composition for photoresists. More specifically, the present invention relates to a photoresist stripper composition which has an outstanding photoresist peeling ability and is able to peel large volumes of photoresist even in relatively small amounts, and which can be employed even under high-temperature processing conditions, and which also does not react with other components within the composition and does not produce unnecessary by-products. The present invention also relates to a photoresist peeling method employing the photoresist stripper composition.