Method for manufacturing organic electronic device sealing body

The present invention pertains to a method for manufacturing an organic electronic device sealing body by adhesively integrating a sheet-like sealing material into an organic electronic device, wherein the sealing material is made of a modified hydrocarbon soft resin having an alkoxysilyl group. The method for manufacturing an organic electronic device sealing body comprises: step [1], in which the organic electronic device and the sheet-like sealing material are overlapped to obtain a laminate; step [2], in which the obtained laminate is housed in a resin bag, the gas in the bag is evacuated, and the bag containing the laminate is then sealed; and step [3], in which the sealed bag is placed under a pressure of 0.1 MPa or higher to thereby adhesively integrate the laminate. According to the present invention, a method for manufacturing an organic electronic device sealing body is provided, wherein a sealing material made of a resin having excellent sealing performance is used to enable industrially advantageous sealing of organic electronic devices having organic functional elements such as organic EL elements or organic semiconductor elements.