Wafer level monitoring and process optimization for robust via EM reliability
1998
Via electromigration (EM) lifetime correlates with the initial via resistance. We have found that the single Kelvin via structure is more effective as a wafer-level reliability (WLR) monitor than the via chains. Using this monitor, we have optimized the via process for 0.35 u/0.25 u applications.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
2
References
2
Citations
NaN
KQI