Interface microstructure evolution and bonding strength of TC11/γ-TiAl bi-materials fabricated by laser powder deposition

Laser powder deposition was applied to fabricate the Ti–6.5Al–3.5Mo–1.5Zr–0.3Si (wt%)/Ti–47Al–2Cr–2Nb–0.2W–0.15B (at%) bi-material system. The as-deposited TC11 alloy shows a basket-wave-like morphology while the as-deposited γ-TiAl alloy consists of fully α2/γ lamellar microstructures. Regarding the thermal mismatch between TC11 and γ-TiAl during processing, the interface microstructure evolution was concerned. The transformation pathway was illustrated. It is found that the content changes of Al elements and β-stabilizers Mo, Cr, and Nb are responsible for the evolution of microstructures at the interface. The fracture surfaces are located at the γ-TiAl side. The bi-material shows a brittle-fracture manner, with the ultimate tensile strength of 560 MPa.