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Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias
Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias
2020
Trevor M. Braun
Daniel Josell
Jimmy John
Suraj Deshpande
Thomas P. Moffat
Keywords:
Optoelectronics
Millimeter
Materials science
Copper
Silicon
Correction
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