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Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN
Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN
2006
Kostyantyn Markov
Torsten Keiler
Alexander Chernyakov
Ciaran Curtin
Patric Heide
Keywords:
Amplifier
Wireless
Chip
Electrical engineering
Electronic engineering
Thermal resistance
Materials science
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