Method for printing black soldermask on PCB board

The invention relates to a process for manufacturing a PCB board, in particular to a method for printing black resistance weld on a PCB board. The method comprises the followings steps: firstly, treating the copper surface by a grind plate, and cleaning the copper surface; performing brown oxide on the copper surface to form a layer of organic metallic membrane on the copper surface; thirdly, drying the board after the brown oxide and performing black soldermask print; transferring a soldermask pattern; solidifying the soldermask by roasting; and removing the browning membrane on the soldermask window. By coating a layer of membrane on the copper surface, the soldermask redness caused by printing the black soldermask on the copper surface is avoided, the product appearance is better improved, particularly after the contrast influence of the redness on the surface of the PCB board printed with the black soldermask is eliminated, and the product is more noble and beautiful. In addition,the coating can also improve the bonding force between the soldermask and the board. Therefore, the method is simple and feasible, and has a great number of advantages.