Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure

Provided is a circuit connecting adhesive film to be used for bonding a first circuit member with a second circuit member. The circuit connecting adhesive film is provided with an adhesive layer and an adhesive layer laminated on the adhesive layer. When the circuit connecting adhesive film is adhered on a surface on a first connecting terminal side of the first circuit member, by permitting the adhesive layer to make contact with the first circuit member, the peeling strength is larger than that when the adhesive layer is adhered on a surface on the first connecting terminal side of the first circuit member, and the thickness of the adhesive layer is 0.1-5.0[mu]m.