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Design, Simulation and Process Optimization of AuInSn Low Temperature TLP bonding for 3D IC Stacking
Design, Simulation and Process Optimization of AuInSn Low Temperature TLP bonding for 3D IC Stacking
2011
Ling Xie
Won-Kyoung Choi
C. S. Premachandran
Cheryl S. Selvanayagam
Ke Wu Bai
Ying Zhi Zeng
Siong Chiew Ong
Liao Ebin
Ahmad Khairyanto
Vasarla Nagendra Sekhar
Serene Thew
Keywords:
Stacking
Process optimization
Temperature cycling
Phase change
Structural engineering
Composite material
Three-dimensional integrated circuit
Shear strength
Materials science
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