Adhesive composition, adhesive tape, and wafer processing method

An adhesive having an initial adhesive force necessary and sufficient for fixing an adherend and capable of being easily peeled off without being left behind even after a high temperature processing process of 200 ° C. or higher. An adhesive composition, an adhesive tape using the adhesive composition, and a wafer processing method using the adhesive composition are provided. A pressure-sensitive adhesive composition containing a silicone pressure-sensitive adhesive and fumed silica having an average particle size of 0.05 to 3 μm. [Selection figure] None