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Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations
Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations
2019
Faical Arabi
A. Gracia
Jean-Yves Delétage
Hélène Fremont
Keywords:
Printed circuit board
Vibration
Temperature cycling
Materials science
Mechanical engineering
Correction
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