Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Paul R. Berger,Muhammad Mustafa Hussain,Francesca Iacopi,Jörg Schulze,Peide D. Ye,Willy Rachmady,Huang-Chun Wen,Siddharth Krishnan

Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

2021

Paul R. Berger
Muhammad Mustafa Hussain
Francesca Iacopi
Jörg Schulze
Peide D. Ye
Willy Rachmady
Huang-Chun Wen
Siddharth Krishnan

Thermal budgets hinder leading-edge ultra-scaled and novel designs, and moving to reduced temperature processing is becoming an acute impediment globally.

Keywords:

Thermal
electronic materials
Edge device
Reduced properties
Engineering physics
Materials science

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