BSI image sensor chips with integrated color filters and process for their preparation

facility with a semiconductor substrate (26) having a front side and a back side; a plurality of image sensors (24) on the front side (26A) of the semiconductor substrate (26) are arranged; a plurality of transparent color filters (46) on the back (26B) of the semiconductor substrate (26); and a plurality of metal rings (49) each encircling one of the plurality of the transparent color filter (46), wherein the plurality of the metal rings (49) spaced from one another and / or connected to each other to form a metal mesh, and wherein the device further comprises a plurality of colored color filters (50) in the spaces between the metal rings (49) are arranged, said metal rings (49) separate transparent color filter (46) of colored color filters (50) and colored color filter (50) can contact each other.