无铅焊料的电迁移效应及规避 Electromigration in Lead-Free Solder and Its Avoidance

电子产品的微型化和多功能化发展显著增大了封装焊点的电流密度，也加剧了电迁移引起的焊点失效问题。本文论述了无铅焊料的电迁移失效的物理机制及从布线几何形状、热效应、晶粒大小、介质膜等方面说明电迁移的影响因素，介绍了电迁移的危害，进而从结构设计、焊接工艺和材料的选择等方面分析了抑制电迁移的措施。 The development of miniaturization and multi-functionality of electronic products increases the current density in lead-free solder joints and promotes the failure caused by electromigration. This paper discusses the physical mechanism of lead-free solder electromigration failure and from the wiring geometry, thermal effect, grain size, dielectric film and other aspects of the electrical factors the impact of migration, introduces the electromigration damage, and then from the structure design, welding process and materials selection and other aspects of suppressing electromigration measures.