Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy

A thermal interface material (TIM) with high thermal conductivity and excellent flexibility is present using a special process. In our method, the low- melting-temperature alloy (LMTA) is used to produce metallurgical bonding between heat-conducting particles. Then the foaming agent is brought in material preparation to build a uniform inter-connective porous structure throughout the composite, and afterwards, organic silicone resin will completely fill the matrix above in a vacuum. After curing, the silicone resin can offer necessary restriction for leak problem of LMTA, meanwhile, the composite material can also absorb shock and provide optimum bonding with contact surfaces.