Analysis of substrate integrated waveguide structures VIA a periodic transverse‐wave iterative formulation

In this article, the theory and numerical algorithm of a periodic wave concept iterative method are presented for the analysis of periodic structures of metallic via-holes. The method is based on the transverse wave formulation using the periodic boundary conditions to extract the single via-hole's impedance. As application a substrate integrated waveguide structures are studied. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:880–884, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.25873