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Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
1992
M. M. Hou
Thomas W. Eagar
Keywords:
Copper
Aluminium
Residual stress
Engineering
Electronic packaging
Metallurgy
Tin
liquid phase
Correction
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