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Acemap > Paper > 水素雰囲気中時効Cu-3 at.%Ti合金の硬さ、導電率および組織へ及ぼす水素圧力の影響

水素雰囲気中時効Cu-3 at.%Ti合金の硬さ、導電率および組織へ及ぼす水素圧力の影響

2010 
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