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About Present Condition and Outlook of Packaging Technology for a Power Semiconductor Module
About Present Condition and Outlook of Packaging Technology for a Power Semiconductor Module
2015
Yoshinari Ikeda
Yoshitaka Nishimura
Eiji Mochizuki
Yoshikazu Takahashi
Keywords:
Power semiconductor device
Packaging engineering
Electronic engineering
MOSFET
Semiconductor
Electrical engineering
Power module
Materials science
Insulated-gate bipolar transistor
Correction
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