Preparation method for support-free micronscale ultrathin ceramic chip

The invention discloses a preparation method for a support-free micronscale ultrathin ceramic chip. According to the method, metallic oxides or metallic salts comprising manganese, cobalt, nickel, copper and ferrum are adopted as raw materials; nanoscale ceramic oxide powder is prepared firstly; uniformly-pelleted ceramic oxide powder is then prepared; the ceramic oxide powder and dispersing agent are uniformly mixed with each other, dried, filtered through a sieve, and mixed uniformly with an organic solvent through ball milling, so that a ceramic sizing material used for serigraphy is prepared; the sizing material is uniformly printed onto a substrate through the serigraphy technology to form a chip; the chip is separated from the substrate through drying, vacuum encapsulation, cold isostatic pressing, and other technologies, so that the support-free chip is generated; the chip is sintered at high temperature to form ceramic, and the support-free ceramic chip with excellent crystallinity and excellent compactness is obtained. The method is cheap, has the advantages of good reliability, high finished product ratio, high flatness, accuracy in thickness control, interior uniformity, and the like, is suitable for manufacturing the support-free micronscale ultrathin ceramic chip in various thicknesses for various ceramic materials, and has a great application prospect.