Copper alloy for mutual connection between chip and package and its production

PROBLEM TO BE SOLVED: To provide a copper alloy containing at least one alloy component, capable of being suitably used for the mutual connection between chip and package. SOLUTION: This alloy is a copper alloy usable for the mutual connection between chip and package and containing 0.01-10wt.% of at least one alloy component selected from carbon, indium, and tin in order to obtain improved electromigration resistance, low resistivity, and excellent corrosion resistance. Further, the copper alloy is first formed and then annealed to allow the alloy component to diffuse toward the grain boundaries between the crystalline grains in the alloy, by which the above-mentioned mutual connection and a conductor can be attained. COPYRIGHT: (C)1997,JPO