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Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.
Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.
2022
Seongkyung Kim
Ukjin Jung
Seungjin Choo
Kihyun Choi
Tae Jin Chung
Shin Young Chung
Eun-Cheol Lee
Juhun Park
Myung-Yoon Um
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