Hyper-graph based partitioning to reduce DFT cost for pre-bond 3D-IC testing

3D IC technology has demonstrated significant performance and power gains over 2D. However, for technology to be viable yield should be increased. Testing a complete 3D IC after stacking leads to an exponential decay in yield. Pre-bond tests are required to insure correct functionality of the die. In this work we propose a hypergraph based biased netlist partitioning scheme scheme for pre-bond testing of individual dies to reduce extra-hardware (flip-flops) required. Further reduction in hardware is achieved by a logic cone based flip-flop sharing scheme. Simulation results on ISCAS89 benchmark circuits and several industrial benchmarks demonstrate the effectiveness of the proposed approach.