High performance on-chip differential signaling using passive compensation for global communication

To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines is proposed and optimized. We propose a signaling structure to compensate the distortion and attenuation of on-chip transmission lines, which uses passive compensation and inserts repeated transceivers composing sense amplifiers and inverter chains. An optimization flow for designing this scheme based on eye-diagram prediction and sequential quadratic programming (SQP) is devised. This flow is used to study the latency, power dissipation and throughput performance of the new global wiring scheme as the technology scales from 90 nm to 22 nm. Comparing to repeated RC wire, experimental results demonstrate that at 22 nm technology node, the new scheme can reduce the normalized delay by 80%-95%, the normalized energy consumption by 50%-94%. The normalized latency is 10 ps/mm, the energy per bit is 20 pJ/m, and the throughput is 15 Gbps/μm. All performance metrics are scalable with technology, which makes this approach a potential candidate to break the "interconnect wall" of digital system performance.