Cost-efficient overclocking in immersion-cooled datacenters

Cloud providers typically use air-based solutions for cooling servers in datacenters. However, increasing transistor counts and the end of Dennard scaling will result in chips with thermal design power that exceeds the capabilities of air cooling in the near future. Consequently, providers have started to explore liquid cooling solutions (e.g., cold plates, immersion cooling) for the most power-hungry workloads. By keeping the servers cooler, these new solutions enable providers to operate server components beyond the normal frequency range (i.e., overclocking them) all the time. Still, providers must tradeoff the increase in performance via overclocking with its higher power draw and any component reliability implications.