Method for fabricating film circuit substrate and method for fabricating chip package comprising the same

PURPOSE: A method for manufacturing a film circuit board and a method for manufacturing a chip package are provided to improve the reliability of a device by cutting a film circuit board with a relatively small cut surface. CONSTITUTION: A base film(320) includes a chip mount area and an isolation area. The isolation area is divided into two chip mount areas and includes a cut area(A) and a non-cut area(B). A preliminary wire pattern with a first height is formed on the base film. A wire pattern(341) with a second height is formed in the cut area by selectively etching the preliminary wire pattern of the cut area.