Solder-attachment inspection method, pcb-inspection system, and solder-attachment inspection device

A solder-printing inspection device (10) measures the volume of solder paste on a land on a PCB, and a solder-attachment inspection device (30) measures the wetting height of the solder after reflow. Said solder-attachment inspection device (30) contains: an inspection program which contains a plurality of evaluation criteria for evaluating the measured wetting height; and a selection rule for selecting from said evaluation criteria. Said selection rule defines which evaluation criterion to select depending on the volume of solder paste on the solder site being inspected, as measured by the solder-printing inspection device (10). The solder-printing inspection device (10) reads, from an inspection-data management device (102), the solder-paste volume corresponding to the solder site being inspected and determines the aforementioned evaluation criterion on the basis thereof.