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Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes
Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes
2013
Kei Murayama
Takashi Kurihara
Taiji Sakai
Nobuhiro Imaizumi
Kozo Shimizu
Seiki Sakuyama
Mitsutoshi Higashi
Keywords:
Pillar
Eutectic system
Soldering
Electrode
Thermal copper pillar bump
Flip chip
Composite material
Materials science
Correction
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