Method of manufacturing package, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiece

Provided are a package manufacturing method capable of hot-molding a substrate into a desired shape, and a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A molding step is a step in which in a penetration hole forming step, through-holes are formed by pressing and heating a base substrate wafer with a through-hole forming mold having convex portions corresponding to the through-holes. The through-hole forming mold is formed of a material having an open porosity equal to or larger than 14%.