On recrystallization texture and magnetic property of Cu-Ni alloys

Abstract The crystallographic texture, micro-hardness and magnetic property have been investigated in Cu-57 at.% Ni, Cu-53 at.% Ni, and Cu-49 at.% Ni alloy used as substrates for coated conductors. In this work, a similar rolling texture was observed in the cold rolled condition for the three alloys. For each material, annealing at higher temperature results in a much stronger cube texture but the fraction of annealing twin boundary was quiet low. When annealing at 700 °C and 800 °C, it was presumed that the increase of Cu element increased grain boundary mobility, which then lead to the enhancement of twin boundary and weakened the cube texture. In addition, magnetization measurements indicate that the increase of Cu content can effectively reduce the saturation magnetization in Cu-Ni alloys. The comparatively low ferromagnetism for both Cu-53 at.% Ni and Cu-49 at.% Ni alloys suggests that substrates produced using these materials will benefit from decreasing hysteresis losses for alternating current applications.