Chip embedded PCB(printed circuit board) and semiconductor package using the PCB, and manufacturing method of the PCB

The present invention relates to a chip embedded printed circuit board, a semiconductor package using the same, and a manufacturing method of the chip embedded PCB. The semiconductor package using the chip embedded printed circuit board according to the present invention includes top and bottom semiconductor packages in a package on package (PoP) structure. The bottom semiconductor package includes a base substrate with a predetermined circuit pattern inside; an electronic component electrically connected to the circuit pattern and embedded in the base substrate to allow one surface to be exposed to the upper surface of the base substrate; and a heat dissipation member installed on the exposed surface of the electronic component and emitting heat generated from the electronic component to the outside. By the present invention, a semiconductor package product with an excellent heat dissipation function can be manufactured, thereby improving the reliability of the product.