The performance and reliability of a new plated copper technology on ceramic

A plated copper-on-ceramic technology that can be characterized as a ceramic PC (printed circuit) board is described. Adhesion of the plated copper on 96% alumina, 99.5% alumina, beryllium oxide, and aluminum nitrate was evaluated using a peel test method. The plated copper technology is shown to surpass previous plated copper processes in performance and reliability. >