Low-cost packaging of semiconductor laser arrays
1997
This article reports on a passive self-alignment technique that we developed for semiconductor waveguide array packaging. A flip-chip Si-motherboard technique is described for the packaging of 4-, 8-, and 12-channel 980 nm laser arrays with fiber ribbons. A major aspect of this development is also to show that minor modifications on an existing laser fabrication process, carried out at the IBM Zurich Research Laboratory, and a specially developed motherboard from our lab, allow a passive self-aligned packaging process.
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