Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment

The present invention discloses a method of using a chemical mechanical polishing apparatus for chemical mechanical polishing, the chemical mechanical polishing apparatus comprises a plurality of chemical mechanical polishing machines, robots and transition means, wherein the plurality of chemical mechanical polisher and the transition means disposed around the robot, the method comprising the steps of: a) by said wafer transport robot to the plurality of chemical mechanical polishing of the machine on the transition means for using at least one of said plurality of a chemical mechanical polisher for polishing the wafer; B) by the robot after the polished wafer is conveyed to the transition means; and C) repeating steps a) and B) until all polished wafers. A method for chemical mechanical polishing using the chemical mechanical polishing apparatus according to an embodiment of the present invention has a short transmission distance of the wafer, the wafer transfer time is short and the advantages of high efficiency.