Synthesis and characterization of novel silicon-containing aromatic bispropargyl ether resins and their composites

A series of silicon-containing aromatic bispropargyl ether resins, poly(dimethylsilylene-co-propynylene ether resorcinol) (polymer a), poly(dimethylsilylene-co-propynylene ether bisphenol A) (polymer b) and poly(dimethylsilylene-co-propynylene ether hexafluorobisphenol A) (polymer c), were synthesized. The obtained polymers displayed good heat resistance and processing properties. Degradation temperatures of the three cured polymers at 5% weight loss (Td5) were above 400 °C. The flexural strength, flexural modulus and shear strength of composites of polymer c reached 408 MPa, 53.3 GPa and 24.8 MPa, respectively, which were higher than those of polymers a and b.