Package on package using a bump-less build up layer under (BBUL) -Bausteins

An apparatus comprising: a microelectronic chip, an inactive surface has an active face parallel to the active area and at least one side; Encapsulation material adjacent at least one side of the microelectronic die, wherein the encapsulation material includes a bottom surface substantially planar to said microelectronic die active surface and a top surface substantially planar to inactive surface of said microelectronic die; a via in the encapsulation material, which extends from the upper surface to the lower surface; a first dielectric material layer disposed on at least a portion of the active surface of the microelectronic die and the lower surface of the encapsulation material; a plurality of build-up layers disposed on said first dielectric material layer; and a plurality of conductor tracks arranged on the first dielectric material layer and the build-up layers and in electrical contact with the active surface of the microelectronic die.