Substrate structure and electronic equipment

2007 
Miniaturized housing of the mobile terminal, to provide a substrate structure that can be thinned. Substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along one mounting surface 11A of the substrate 11, the electronic components 12 into close contact with the mounting surface 11A of the substrate 11 as well as covered with a resin 13A and a resin portion 13. Substrate structure 10, a through hole 14 penetrating the substrate 11 in the thickness direction is provided, the mounting surface 11A side of the through-hole 14 is closed by a cover member 15. Raised portion 21 is provided on the peripheral portion of the lid member 15.
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