Through Mold Via (TMV) by gas-aided laser

Cutting of packaged IC involves removal of different materials including semiconductor, metal and polymeric compound. Dicing saw has long been utilized to perform the task in regular (rectangular) shape. However, chipping and micro cracking at the edges and deteriorated strength of the packaged die are still problems to be solved. Laser has the advantages of being capable of cutting irregular shape and finer edge quality with less maintain cost. However, the laser beam has effects on different materials to be process and debris becomes a problem to be solved. Laser cutting is a standard industrial process for cutting sheet metals. The process relies on the removal of the melted material with the aid of a pressurized assist gas. In the same token we studied the effect of different aiding gases on cutting packaged IC epoxy molding compound (EMC) by a UV (355nm wavelength) laser. Among the main variables controlling the process, the assisting gas type is an essential factor. This study presents a study on the influence of different assisting gases (argon, nitrogen, oxygen and air) on the edge quality. In addition, the cutting speed can be improved due to faster removal of debris. Edge quality on though molding via (TMV) technology has been dramatically improved by gas-aided laser.