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Investigation of Via Degradation Behavior under Thermal Cycling Stress on Power Device
Investigation of Via Degradation Behavior under Thermal Cycling Stress on Power Device
2013
M Zhang
Yasuki Yoshihisa
Keiichi Furuya
Yukari Imai
Kenichi Hatasako
Shigeto Maegawa
Keywords:
Composite material
Temperature cycling
Materials science
Degradation (geology)
Correction
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