The Research on Thermal Residual Stress of SiCp/Al Composites

SiCp/Al composites would produce a large thermal residual stresses field during cooling process. The thermal residual stress has a greater impact to the composites dimension stability and the accuracy of application. In this paper, the thermal residual stress in SiCp/A356 composites was measured by X-ray diffraction and simulated by finite element method (FEM), the influence of particle shapes and cooling rates are considered, the stress field contour nephogram and stress-time curve during cooling was simulated. The studies present residual stress formed during cooling process because of the difference of thermal expansion coefficient (CTE) between SiC particle and aluminum alloy, the maximum stress distributes near the interface of matrix/SiCp mainly. The stress-time curves are inconsistent under different cooling rates, the higher cooling rate, the more dramatic variety in stress.