Solder ink and device package using the same

PURPOSE: A solder ink and an electronic device package using the same are provided to implement soldering through a consecutive printing process, thereby improving accuracy. CONSTITUTION: In a solder ink and an electronic device package using the same, . A binder includes a first resin comprised of a colophony resin or a modified colophony resin. The first rinse improves the soldering of a solder pump. The binder has a function of applying printability to a solder ink. A solder ink includes a hardener and a thickener.