Electroplating apparatus for semiconductor substrate and method the same

PURPOSE: An electrical plating device and a method of a semiconductor substrate are provided to improve uniformity of plating by controlling the flow of plating liquid in a specific region. CONSTITUTION: A plating bath(10) stores plating liquid. A pedal(40) is installed in the plating bath. The pedal has a plurality of holes. The plating liquid flows to a substrate via the plurality of holes. A flow enhancement unit(41) selectively increases the flow of the plating liquid.